The global lead frame market is estimated to value US$ 2.5 Bn in 2017 and is projected to register a CAGR of 3.7% in terms of value during the forecast period 2017–2026. Lead frame is a metal frame which is considered the foundation of semiconductor packaging that supports an integrated circuit die or chip. It consists of bonding material made of aluminum or copper. Lead frame helps in easy circuit connection of the IC chip to other electrical contacts or components.

Segmentation Analysis: 

Analysis by Product Type: Among all type segments, the dual layer lead frame segment in the global lead frame market is expected to register highest share in the target market

Analysis by Application: Among all the application segments, the consumer electronics equipment segment is projected to register highest CAGR of over 3% and is expected to continue its dominance over the forecast period

Analysis by Region: The market in China is expected to account for highest share in terms of revenue in the global lead frame market, expanding at a CAGR over 3% from 2017 to 2026.

Key players operating in the global lead frame market include Precision Micro Ltd., Sumitomo Corporation, Hitachi, Ltd., ENOMOTO Co., Ltd., STATS ChipPAC Pte. Ltd., Mitsui High-tec, Inc., Shinko Electric Industries Co., Ltd., Amkor Technology Inc., Stork Veco B.V., and Ningbo Hualong Electronics Co., Ltd.

Source of Infographics: Lead Frame Market Infographics by MarketResearch